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Studio: Virgil Films And Entertai Release Date: 01/26/2010 Run time: 126 minutesThis digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on June 1, 2010. The length of the article is 4683 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

From the author: Three-dimensional flow and structural analyses were carr! ied out for film insert injection molding to investigate warpage of film insert molded (FIM) parts with respect to variation of film and substrate thickness. Asymmetry of temperature distribution in the thickness direction was increased with increasing film thickness but decreased with increasing substrate thickness. Asymmetry of the in-mold residual stress distribution in the FIM specimen was generated by the nonuniform temperature distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of the ejected FIM specimen was determined by relaxation of the asymmetric in-mold residual stress distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of FIM specimens annealed at 80[degrees]C for 30 min showed complex behavior, and the behavior was understood by using factors such as degree of warpage of the ejected part, thermal shrinkage of the inserte! d film, and retardation of heat transfer. POLYM. ENG. SCI., 50! :1205-12 13, 2010. [C] 2010 Society of Plastics Engineers

Citation Details
Title: Effects of film and substrate dimensions on warpage of film insert molded parts.(Report)
Author: Seong Yun Kim
Publication: Polymer Engineering and Science (Magazine/Journal)
Date: June 1, 2010
Publisher: Society of Plastics Engineers, Inc.
Volume: 50 Issue: 6 Page: 1205(9)

Article Type: Report

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